[MEET1-4 (Invited)]Nanoscale Semiconductor Devices Fabricated using Adhesion Lithography at Low Cost
*Gwenhivir Wyatt-Moon1, Oliver J Burton1, Stephan Hofmann1, Andrew J Flewitt1(1.University of Cambridge (UK))
Keywords:
Nanoelectronics,Bottom-Up fabrication,Large-area electronics
As device features sizes decrease typically fabrication costs increase. By combining adhesion lithography, a fabrication technique to create nanodevices with bottom-up nanomaterial growth this manufacturing rule has been broken. Not only is the fabrication cheaper but there is a decrease in material wastage as compared to traditional top-down fabrication processes