Proceedings of the International Display Workshops Volume 30 (IDW '23)
Dec 6 - Dec 8, 2023TOKI MESSE Niigata Convention Center
Proceedings of the International Display Workshops Volume 30 (IDW '23)
Dec 6 - Dec 8, 2023TOKI MESSE Niigata Convention Center
[FMCp2-3]Wrap-Around Electrode Fabrication via Laser Ablation
*Ya-Huei Chang1, Jie-Chi Chen2, Dih-Yang Kuo1, Kuan-Ting Kuo1, Rajesh Vaddi1, Sean M Garner1(1. Corning Incorporated (United States of America), 2. Industrial Technology Research Institute (Taiwan))
Keywords:
microLED,wrap-around electrodes,seamless tiling
Wrap around electrodes with 50 um linewidth and 150 um spacing have been demonstrated on an as cut glass edge profile of Corning Lotus NXT glass with a thin film transistor array via a laser ablation approach. WAEs exhibit intact integrity of circuits, conformal deposition, and good adhesion.