[FLX4-2]Low-Temperature Fabrication Process for IGZO-TFTs in Future Roll-to-Roll Manufacturing
*Tsukasa Kishiume1, Takao Kokubun1, Masakazu Hori1, Masayoshi Fuchi1, Yoshiaki Kito1, Makoto Nakazumi1(1. Nikon Corporation (Japan))
Keywords:
a-IGZO,Oxide Semiconductor,Roll to Roll,Flexible,OLED
IGZO-TFT backplanes on an A3-size flexible plastic film were developed for flexible electronic devices. We have fabricated the backplanes at process temperatures of 150 °C and 230 °C using a roll-to-roll maskless exposure system. The devices exhibited a mobility of 7.5 cm2/Vs, combined with good reliability under bias stress. Finally, we demonstrated a flexible AMOLED display.