[FLXp1-11L] Cu Nano-Imprinting With a Polymer Electrolyte Membrane Stamp at Room Temperature for Flexible Device Fabrication | Proceedings of the International Display Workshops Volume 31 (IDW '24)

Proceedings of the International Display Workshops Volume 31 (IDW '24)

Dec 4 - Dec 6, 2024Sapporo Convention Center

Back

Proceedings of the International Display Workshops Volume 31 (IDW '24)

Dec 4 - Dec 6, 2024Sapporo Convention Center

[FLXp1-11L]Cu Nano-Imprinting With a Polymer Electrolyte Membrane Stamp at Room Temperature for Flexible Device Fabrication

*Atsuki Tsuji¹, Junji Murata¹(1. Ritsumeikan University (Japan))

https://doi.org/10.36463/idw.2024.1417

Download PDF

Keywords:

Copper,Electrochemical,Polymer electrolyte membrane,Nano-imprinting

Patterned copper (Cu) is used in applications such as metal interconnects. Traditional nanopatterning methods involve complex processes and harsh chemicals. This study introduces a Cu nanopatterning method based on solid-state anodic dissolution at the PEM/Cu interface, which enables direct patterning without resists or harsh chemicals, thereby reducing environmental impact.

Back