[FLXp1-13L]Process Control of Vacuum Forming to Suppress Electrical Conductivity Variation in 3D-Shaped Wires for In-Mold Electronics Applications
*Rina Aida1, Masahiro Inoue1(1. Gunma University (Japan))
Keywords:
in-mold electronics,3D electric circuits,additive printing,vacuum forming
Dynamic percolation for electrical conductivity development in a stretchable wire printed on a thermoplastic substrate can be induced utilizing tensile deformation during a vacuum-forming process to achieve a three-dimensional (3D) wire shape. This phenomenon successfully suppresses the electrical conductivity variation in the wires, ensuring the formation of reliable 3D electric circuits.