[FLXp2/OLEDp5-2L] Core Technologies for Stretchable AMOLED with High Resolution & Stretchability | Proceedings of the International Display Workshops Volume 31 (IDW '24)

Proceedings of the International Display Workshops Volume 31 (IDW '24)

Dec 4 - Dec 6, 2024Sapporo Convention Center

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Proceedings of the International Display Workshops Volume 31 (IDW '24)

Dec 4 - Dec 6, 2024Sapporo Convention Center

[FLXp2/OLEDp5-2L]Core Technologies for Stretchable AMOLED with High Resolution & Stretchability

*MunPyo Hong¹, Jaewan Park¹, Donghoon Kim¹, Sooseong Lee¹, Youngku Jin¹, Gerhard Domann², Daniela Collin²(1. Korea University (Korea), 2. Fraunhofer-Institute for Silicate Research (Germany))

https://doi.org/10.36463/idw.2024.1430

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Keywords:

High Resolution,High Stretchability,Pixelized Encapsulation,Elastic Metal Electrode,Nitinol Dry Etching

This study presents core technologies to simultaneously improve stretchability and resolution. Firstly, we utilized photocurable hybrid capping material and stoichiometric Si₃N₄ thin film for advanced pixelized encapsulation. Secondly, for elastic metal electrode, we achieved fine patterning of a three-layer, composed of superelastic metal NiTi and low-resistance Al thin film, through dry etching at a substrate temperature below 50°C.

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