[MEET2-4(Invited)] Simultaneous Transfer and Bonding (SITRAB) Technology for MicroLED Display Fabrication | Proceedings of the International Display Workshops Volume 31 (IDW '24)

Proceedings of the International Display Workshops Volume 31 (IDW '24)

Dec 4 - Dec 6, 2024Sapporo Convention Center

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Proceedings of the International Display Workshops Volume 31 (IDW '24)

Dec 4 - Dec 6, 2024Sapporo Convention Center

[MEET2-4(Invited)]Simultaneous Transfer and Bonding (SITRAB) Technology for MicroLED Display Fabrication

*Jungho Shin¹, Jiho Joo¹, Gwang-Mun Choi¹, Chanmi Lee¹, Ki-Seok Jang¹, Jin-Hyuk Oh¹, Ji-Eun Jung¹, Ga-Eun Lee¹, Seong-Cheol Kim¹, Yong-Sung Eom¹, Kwang-Seong Choi¹(1. Electronics and Telecommunications Research Institute (Korea))

https://doi.org/10.36463/idw.2024.1093

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Keywords:

Micro-LED,Display,Simultaneous transfer and bonding,SITRAB

Herein, we report a simultaneous transfer and bonding (SITRAB) technology for Micro-LED display fabrication. Micro-LEDs attached on mother substrates are transferred and bonded onto display substrates after the SITRAB-based Micro-LED assembly. By repeating this SITRAB process with different interposers, Micro-LED repair and RGB integration are experimentally demonstrated.

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