The 76th JSAP Autumn Meeting, 2015
Sep 13 - Sep 16, 2015Nagoya Congress Center
The 76th JSAP Autumn Meeting, 2015
Sep 13 - Sep 16, 2015Nagoya Congress Center
[16a-2K-3]Fabrication of Porous Electrode Wiring and Plating for Lowering the Resistance
〇HIDEO TOKUHISA1, SHIHO TSUKAMOTO1, NAOKI SHIRAKAWA1(1.AIST FLEC)
Keywords:
copper,electrode wiring,low resistance
In this study, in order to fabricate a low resistant electrode wiring with almost the same size as the printed pattern, we attempted to form a porous electrode wiring so that a plating solution can penetrate into the inside of the printed wiring and lower the resistance by filling the voids.