SISPAD2023

SISPAD2023

Sep 26 - Sep 29, 2023
SISPAD2023

SISPAD2023

Sep 26 - Sep 29, 2023

[Session_1-05]Full Chip Stress Model for Flash BEOL Crack Failure Risk Analysis

*Kyungmi Yeom1, Geunsang Yoo1, Anthony Payet2, Alexander Schmidt1, Hyoshin Ahn1, Inkook Jang1, Yutaka Nishizawa2, Masaru Uchiyama2, Yasuyuki Kayama2, Satoru Yamada2, Dae Sin Kim1(1. CSE Team, Innovation Center, Samsung Electronics, 2. DSRJ)