SISPAD2023

SISPAD2023

Sep 26 - Sep 29, 2023
SISPAD2023

SISPAD2023

Sep 26 - Sep 29, 2023

[Session_5-05]Effect of Metal Coupling on Schottky Barrier Height Extraction

Sheng-Kai Su1, Edward Chen1, Alfonso Sanchez-Soares2, Thomas Kelly2, Giorgos Fagas2,4, *James C. Greer2,5, Gregory Pitner 3, H.-S. Philip Wong1,6, Iuliana P. Radu1(1. TSMC, Hsinchu, Taiwan, 2. EOLAS Designs Ltd, 3. TSMC, San Jose, USA, 4. Tyndall Nat'l Inst., Univ. College Cork, 5. Electrical and Electronic Engineering Department, Univ. of Nottingham Ningbo China, 6. Department of Electrical Engineering, Stanford Univ.)