2003 International Conference on Solid State Devices and Materials

2003 International Conference on Solid State Devices and Materials

Sep 16 - Sep 18, 2003Keio Plaza Inter-Continental Tokyo (Keio Plaza Hotel), Tokyo, Japan
International Conference on Solid State Devices and Materials
2003 International Conference on Solid State Devices and Materials

2003 International Conference on Solid State Devices and Materials

Sep 16 - Sep 18, 2003Keio Plaza Inter-Continental Tokyo (Keio Plaza Hotel), Tokyo, Japan

[A-7-4]Characterization of Soft Breakdown Effects for Post-deposition NH3 Plasma Treated HfO2 Gate Dielectrics

Jer Chyi Wang, De Ching Shie, Tan Fu Lei, Chung Len Lee(1.Department of Electronics Engineering, National Chiao Tung University)
https://doi.org/10.7567/SSDM.2003.A-7-4