ICSCRM2019
2019年9月29日〜10月4日Kyoto International Conference Center
ICSCRM2019
2019年9月29日〜10月4日Kyoto International Conference Center
[Tu-1A-02]Improving Heat Conduction of Insulated Metal Substrate with Thermal Pyrolytic Graphite Core for SiC Power Module Packaging
*Wei Fan1, Garry Wexler2, Emre Gurpinar3, Burak Ozpineci3(1. Momentive Performance Materials Inc.(United States of America), 2. Henkel Corp.(United States of America), 3. Oak Ridge National Laboratory(United States of America))