1989 Conference on Solid State Devices and Materials

1989 Conference on Solid State Devices and Materials

1989年8月28日〜8月30日Nippon Toshi Center, Tokyo, Japan
戻る
International Conference on Solid State Devices and Materials
1989 Conference on Solid State Devices and Materials

1989 Conference on Solid State Devices and Materials

1989年8月28日〜8月30日Nippon Toshi Center, Tokyo, Japan

[A-1-4]Thermal Stability Studies on Copper Thin Films Formed by a Low-Kinetic-Energy Particle Process

Tatsuyiki Saito、Tadahiro Ohmi、Tadashi Shibata、Masahito Otsuki、Takahisa Nitta(1.Department of Electronics, Faculty of Engineering Tohoku University、2.Device Development Center, Hitachi Ltd.)
https://doi.org/10.7567/SSDM.1989.A-1-4
PDFダウンロードPDFダウンロード
戻る