1995 International Conference on Solid State Devices and Materials
1995年8月21日〜8月24日International House, Osaka, Japan
1995 International Conference on Solid State Devices and Materials
1995年8月21日〜8月24日International House, Osaka, Japan
[S-IV-10]Double-Level Cu Inlaid Interconnects with Simultaneously Filled Via-Plugs
G. Minamihaba、Y. Shimooka、H. Tamura、T. Iijima、T. Kawanoue、H. Hirabayashi、N. Sakurai、H. Ookawa、T. Obara、H. Egawa、T. Idaka、T. Kubota、T. Shimizu、M. Koyama、G. Ooshima、K. Suguro(1.ULSI Research Laboratories, Manufacturing Engineering Research Center, Semiconductor Division, TOSHIBA Corporation)
