1995 International Conference on Solid State Devices and Materials

1995 International Conference on Solid State Devices and Materials

1995年8月21日〜8月24日International House, Osaka, Japan
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International Conference on Solid State Devices and Materials
1995 International Conference on Solid State Devices and Materials

1995 International Conference on Solid State Devices and Materials

1995年8月21日〜8月24日International House, Osaka, Japan

[S-IV-8]In Situ Study of Electromigration in Submicron-Wide Layered Al-0.5%Cu Lines by Side-View TEM Observation

Hidekazu OKABAYASHI、Masao KOMATSU、Hirotaro MORI(1.Research and Development Group, NEC Corp.、2.Research Center for Ultra-High Voltage Electron Microscopy, Osaka University)
https://doi.org/10.7567/SSDM.1995.S-IV-8
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