1996 International Conference on Solid State Devices and Materials

1996 International Conference on Solid State Devices and Materials

1996年8月26日〜8月29日Pacifico Yokohama, Yokohama, Japan
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International Conference on Solid State Devices and Materials
1996 International Conference on Solid State Devices and Materials

1996 International Conference on Solid State Devices and Materials

1996年8月26日〜8月29日Pacifico Yokohama, Yokohama, Japan

[A-3-2]Self-Aligned Passivation Technology for Copper Interconnection Using Copper-Aluminum Alloy

Nobuyoshi Awaya、Toshio Kobayashi(1.NTT LSI Laboratories)
https://doi.org/10.7567/SSDM.1996.A-3-2
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