1996 International Conference on Solid State Devices and Materials

1996 International Conference on Solid State Devices and Materials

1996年8月26日〜8月29日Pacifico Yokohama, Yokohama, Japan
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International Conference on Solid State Devices and Materials
1996 International Conference on Solid State Devices and Materials

1996 International Conference on Solid State Devices and Materials

1996年8月26日〜8月29日Pacifico Yokohama, Yokohama, Japan

[A-3-3]Gap-Filling of Cu Employing Self-Sustained Sputtering with ICP Ionization

Takanori ICHIKI、Toshiaki KIKUCHI、Atsushi SANO、Shoso SHINGUBARA、Yasuhiro HORIIKE(1.Department of Electrical & Electronics Engineering, Toyo University、2.Department of Electrical Engineering, Hiroshima University)
https://doi.org/10.7567/SSDM.1996.A-3-3
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