1996 International Conference on Solid State Devices and Materials

1996 International Conference on Solid State Devices and Materials

1996年8月26日〜8月29日Pacifico Yokohama, Yokohama, Japan
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International Conference on Solid State Devices and Materials
1996 International Conference on Solid State Devices and Materials

1996 International Conference on Solid State Devices and Materials

1996年8月26日〜8月29日Pacifico Yokohama, Yokohama, Japan

[A-3-4]A Study of Via-Electromigration Failure in Multilevel Interconnection with High Temperature Sputtered Aluminum

Makiko Kageyama、Keiichi Hashimoto、Hiroshi Onoda(1.VLSI R&D Center, Oki Electric Industry Co., Ltd.)
https://doi.org/10.7567/SSDM.1996.A-3-4
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