2000 International Conference on Solid State Devices and Materials

2000 International Conference on Solid State Devices and Materials

2000年8月29日〜8月31日Sendai International Center, Sendai, Japan
戻る
International Conference on Solid State Devices and Materials
2000 International Conference on Solid State Devices and Materials

2000 International Conference on Solid State Devices and Materials

2000年8月29日〜8月31日Sendai International Center, Sendai, Japan

[A-1-4]A Study on Mechanism of Chemical Mechanical Polishing on Al and Cu Surfaces Employing In-situ Infrared Spectroscopy

Hiroki Ogawa、Yusuke Tokuyama、Michihiko Yanagisawa、Jun Kikuchi、Yasuhiro Horiike(1.Department of Materials Science, School of Engineering, University of Tokyo、2.Speedfam-IPEC Co., Ltd.、3.Axiomatec Inc.)
https://doi.org/10.7567/SSDM.2000.A-1-4
PDFダウンロードPDFダウンロード
戻る