2000 International Conference on Solid State Devices and Materials

2000 International Conference on Solid State Devices and Materials

2000年8月29日〜8月31日Sendai International Center, Sendai, Japan
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International Conference on Solid State Devices and Materials
2000 International Conference on Solid State Devices and Materials

2000 International Conference on Solid State Devices and Materials

2000年8月29日〜8月31日Sendai International Center, Sendai, Japan

[A-1-5]Characterization of Tungsten Carbide as Diffusion Barrier for Cu Metallization

Shui Jinn Wang、Hao Yi Tsai、S. C. Sun(1.Microelectronics Lab., Dept. of Electrical Engineering, National Cheng Kung University、2.R&D, Wafertech)
https://doi.org/10.7567/SSDM.2000.A-1-5
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