2000 International Conference on Solid State Devices and Materials

2000 International Conference on Solid State Devices and Materials

2000年8月29日〜8月31日Sendai International Center, Sendai, Japan
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International Conference on Solid State Devices and Materials
2000 International Conference on Solid State Devices and Materials

2000 International Conference on Solid State Devices and Materials

2000年8月29日〜8月31日Sendai International Center, Sendai, Japan

[A-2-1]Reliability and Electromigration Failure Modes in Dual Inlaid Cu Interconnects

C. Capasso、M. Herrick、M. Gall、D. Jawarani、S. Thrasher、L. Zhao、H. Kawasaki(1.Advanced Products Research and Development Laboratory DigitalDNA TM Laboratories, Motorola、2.Technology Development Group, Advanced Micro Devices)
https://doi.org/10.7567/SSDM.2000.A-2-1
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