2000 International Conference on Solid State Devices and Materials
2000年8月29日〜8月31日Sendai International Center, Sendai, Japan
2000 International Conference on Solid State Devices and Materials
2000年8月29日〜8月31日Sendai International Center, Sendai, Japan
[A-2-3]Ultra-Thin Silicon Oxynitride Films as Cu Diffusion Barrier for Lowering Interconnect Resistivity
Tetsuhiro Nanbu、Katsuyuki Sekine、Yuji Saito、Shin-ichi Nakao、Masaki Hirayama、Tadahiro Ohmi(1.Department of Electronic Engineering, Graduate School of Engineering, Tohoku University、2.New Industry Creation Hatchery Center, Tohoku University)
