[A-2-2]Spin-Drying with CO2 Gas Purge for 0.13 μm DRAM's Contact Process
Yoshihiro Ogawa、Hisashi Okuchi、Hiroshi Tomita、Kunihiro Miyazaki、Kazuhiko Takase、Soichi Nadahara(1.Process and Manufacturing Engineering center., Toshiba Corp. Semiconductor company)
