2001 International Conference on Solid State Devices and Materials

2001 International Conference on Solid State Devices and Materials

2001年9月26日〜9月28日Diamond Hotel, Tokyo, Japan
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International Conference on Solid State Devices and Materials
2001 International Conference on Solid State Devices and Materials

2001 International Conference on Solid State Devices and Materials

2001年9月26日〜9月28日Diamond Hotel, Tokyo, Japan

[A-2-6]A Thermally Robust Ti-Rich TiNx Contact Metallization Realizing an Interconnect System Suitable to 0.10-μm DRAMs and Beyond

Isamu Asano、Yoshitaka Nakamura、Hideo Aoki、Naoki Fukuda、Satoru Yamada、Toshihiro Sekiguchi(1.ELPIDA MEMORY, Inc.、2.Device Development Center, Hitachi Ltd.、3.Semiconductor Group, Hitachi Ltd.)
https://doi.org/10.7567/SSDM.2001.A-2-6
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