2001 International Conference on Solid State Devices and Materials

2001 International Conference on Solid State Devices and Materials

2001年9月26日〜9月28日Diamond Hotel, Tokyo, Japan
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International Conference on Solid State Devices and Materials
2001 International Conference on Solid State Devices and Materials

2001 International Conference on Solid State Devices and Materials

2001年9月26日〜9月28日Diamond Hotel, Tokyo, Japan

[B-1-3]Electroplating Cu Filling Study for Thorough Electrode in Silicon Wafer of Three Dimensional LSI Chip Stacking

M. Tomisaka、H. Yonemura、M. Hoshino、K. Takahashi(1.Electronic System Integration Technology Research Department, Association of Super-Advanced Electronic Technologies (ASET))
https://doi.org/10.7567/SSDM.2001.B-1-3
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