2001 International Conference on Solid State Devices and Materials

2001 International Conference on Solid State Devices and Materials

2001年9月26日〜9月28日Diamond Hotel, Tokyo, Japan
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International Conference on Solid State Devices and Materials
2001 International Conference on Solid State Devices and Materials

2001 International Conference on Solid State Devices and Materials

2001年9月26日〜9月28日Diamond Hotel, Tokyo, Japan

[B-1-4]Feasibility of Direct Bonding Between CMP-Cu Films at Room Temperature for Bumpless Interconnect

Akitsu Shigetou、Naoe Hosoda、Toshihiro Itoh、Tadatomo Suga(1.Research Center for Advanced Science and Technology, The University of Tokyo)
https://doi.org/10.7567/SSDM.2001.B-1-4
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