[LB-1-1]Micro Bump Interconnection Technologies in 20 μm Pitch on 3D System in Package
Tadahiro Morifuji、Yoshihiro Tomita、Ryoichi Kajiwara、Kenji Takahashi(1.Association of Super-Advanced Electronics Technologies (ASET) Electronic System Integration Technology Research Department, Tsukuba Research Center Room C-B-5, Tsukuba Center Inc.)
