2002 International Conference on Solid State Devices and Materials

2002 International Conference on Solid State Devices and Materials

2002年9月17日〜9月19日Nagoya Congress Center, Nagoya, Japan
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International Conference on Solid State Devices and Materials
2002 International Conference on Solid State Devices and Materials

2002 International Conference on Solid State Devices and Materials

2002年9月17日〜9月19日Nagoya Congress Center, Nagoya, Japan

[B-2-1]ADHESION AND RELIABILITY IN THIN-FILM STRUCTURES CONTAINING CU AND LOW K MATERIALS: EXPERIMENTS AND MULTI-SCALE SIMULATIONS

Reinhold H. Dauskardt(1.Department of Materials Science and Engineering Stanford University)
https://doi.org/10.7567/SSDM.2002.B-2-1
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