2004 International Conference on Solid State Devices and Materials

2004 International Conference on Solid State Devices and Materials

2004年9月14日〜9月17日Tower Hall Funabori, Tokyo, Japan
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International Conference on Solid State Devices and Materials
2004 International Conference on Solid State Devices and Materials

2004 International Conference on Solid State Devices and Materials

2004年9月14日〜9月17日Tower Hall Funabori, Tokyo, Japan

[B-2-3]Etch-byproduct Pore Sealing for ALD -TaN Deposition on Porous Low-k Film

Akira Furuya、Eiichi Soda、Hiroshi Okamura、Nobuyuki Ohtsuka、Miyoko Shimada、Naofumi Ohashi、Shinichi Ogawa(1.Semiconductor Leading Edge Technologies Inc. (Selete))
https://doi.org/10.7567/SSDM.2004.B-2-3
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