2009 International Conference on Solid State Devices and Materials

2009 International Conference on Solid State Devices and Materials

2009年10月6日〜10月9日Sendai Kokusai Hotel, Miyagi, Japan
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International Conference on Solid State Devices and Materials
2009 International Conference on Solid State Devices and Materials

2009 International Conference on Solid State Devices and Materials

2009年10月6日〜10月9日Sendai Kokusai Hotel, Miyagi, Japan

[B-5-2]Effect of Post Cap-Layer Deposition Annealing Temperature and TiN Thickness on SMDH CMOS Process using TiN Hard Mask

H. Shinohara1、A. Katakami1、T. Watanabe1、M. Hayashi1、S. Kamiyama1、Y. Sugita1、T. Matsuki1、T. Eimori1、J. Yugami1、K. Ikeda1、Y. Ohji1(1.Selete)
https://doi.org/10.7567/SSDM.2009.B-5-2
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