International Conference on Solid State Devices and Materials

2015 International Conference on Solid State Devices and Materials

2015年9月27日〜9月30日Sapporo Convention Center, Sapporo, Japan

International Conference on Solid State Devices and Materials

2015 International Conference on Solid State Devices and Materials

2015年9月27日〜9月30日Sapporo Convention Center, Sapporo, Japan

[A-3-4]Suppression of Void Generation in Direct Wafer Bonding for Si High-k MOS Optical Modulators using Al₂O₃/HfO₂ Bonding Interface

^○J. H. Han^{1, 2}, M. Takenaka^{1, 2}, S. Takagi^{1, 2}(1.Univ. of Tokyo, 2.JST-CREST(Japan))

https://doi.org/10.7567/SSDM.2015.A-3-4

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