Presentation Information
[Tu-P-48]Deciphering and Overcoming Interfacial Thermal Degradation in Tellurium Devices
*Wan-Ping Shen1, Sung-Tsun Wang1, Der-Hsien Lien1 (1. National Yang Ming Chiao Tung University (Taiwan))
Keywords:
Tellurium transistors,Thermal reliability,Contact diffusion,Cohesive energy,Monolithic 3D integration
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