[TuP3D] D. Photonic devices and related technologies

[TuP3D-13] Thermal-Simulation-Based Design and Optimization of Distributed Feedback (DFB) Laser Packaging for 3D Photonic Integration

〇Thu Huong Bui¹, Kung-An Lin², Lucas Yang², Chao-Hsin Wu^1,2,3 (1. Graduate School of Advanced Technology, National Taiwan Univ. (Taiwan), 2. Graduate Institute of Photonics and Optoelectronics, National Taiwan Univ. (Taiwan), 3. Graduate Institute of Electronics Engineering, National Taiwan Univ. (Taiwan))

Co-Packaged Optics (CPO) enables tight integration of photonic devices and high-speed electronics for next-generation data centers. This work investigates the thermal behavior of a 2.5D CPO architecture integrating a DFB laser and EIC using finite element analysis. The effects of microbump materials and TSV geometry are evaluated, showing that Au microbumps improve thermal performance, while smaller TSV diameters mitigate CTE-induced stress, providing design guidelines for reliable CPO integration.