[TuP3D] D. Photonic devices and related technologies

[TuP3D-17] Investigation of Thermal Characteristics in Epi-up and Epi-down Mounted 1.31-μm Short-Cavity DFB Lasers for CPO Applications

〇Yu-Chun Chen³, Te-Hua Liu¹, Yi-Hsuan Chen³, Chao-Hsin Wu^1,2,3,4 (1. Graduate School of Advanced Technology, National Taiwan Univ. (Taiwan), 2. Center for Quantum Science and Engineering, National Taiwan Univ. (Taiwan), 3. Graduate Institute of Photonics and Optoelectronics, National Taiwan Univ. (Taiwan), 4. Graduate Institute of Electronics Engineering, National Taiwan Univ. (Taiwan))

This study investigates the thermal characteristics of 1.31-μm Distributed Feedback (DFB) lasers with a 750-μm short cavity, specifically designed for uncooled co-packaged optics (CPO) applications. By conducting a comparative analysis between epi-up and epi-down packaging configurations, the research identifies the critical impact of thermal management on device performance. Key results demonstrate that the epi-down configuration achieves a maximum output power of 177.74 mW and maintains stable single-mode operation (SMSR > 40 dB) at temperatures up to 105°C. Notably, the epi-down design exhibits a 40.52% improvement in thermal stability, characterized by a significantly lower PCE decrease rate compared to the epi-up configuration. Furthermore, it achieves a reduced thermal resistance of 60.1 °C/W. These findings emphasize that optimizing thermal dissipation paths through epi-down mounting is essential for developing high-efficiency, reliable light sources for next-generation silicon photonic engines and high-density optical interconnects.