Presentation Information
[D2-2]Study on Separation of Metal Plates from Bonded Structure with Resin Adhesive using Pulsed Discharge(Proceedings paper)
*Taketoshi Koita1, Keita Sato1, Takao Namihira2, Chiharu Tokoro1,3 (1. Waseda University, Japan, 2. Kumamoto University, Japan, 3. The University of Tokyo, Japan)
