[C-14] マイクロ波テラヘルツ光電子技術

2:15 PM - 2:30 PM JST(5:15 AM - 5:30 AM UTC)

[C-14-03] Flip-Chip Chip-Scale-Package Influence on 300-GHz On-Chip Transmission Lines

○Sangyeop Lee¹, Kyoya Takano², Takeshi Yoshida³ (1. Tokyo Institute of Technology, 2. Tokyo University of Science, 3. Hiroshima University)

Keywords:

Flip-chip chip-scale package,On-chip transmission line,300GHz