The Institute of Electronics, Information and Communication Engineers General Conference
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Presentation Information

11:15 AM - 11:30 AM JST(2:15 AM - 2:30 AM UTC)

[C-2B-06]Thermal Camera and Solder Resist for Temperature Measurement of RF Substrate

○Yuta Sugiyama1, Hidenori Yukawa1, Takeshi Oshima1, Hiroto Ado1, Motoki Futatsuya1, Akimichi Hirota1, Yoshio Inasawa1 (1. Mitsubishi Electric Corp.)
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Keywords:

Thermal Camera,Solder Resist,Infrared emissivity

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