Presentation Information

[C-12-02]Evaluation of Triple Modular Redundancy Flip-Flop Structures with Reduced Area Delay Power Product in a 22 nm Bulk Process

〇Shuhei Mandai1, Ryuichi Nakajima1, Jun Furuta2, Kazutoshi Kobayashi1 (1. Kyoto Institute of Technology, 2. Okayama Prefectural University)

Keywords:

Soft Errors,Flip-Flop

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