Presentation Information
[C-12-02]Evaluation of Triple Modular Redundancy Flip-Flop Structures with Reduced Area Delay Power Product in a 22 nm Bulk Process
〇Shuhei Mandai1, Ryuichi Nakajima1, Jun Furuta2, Kazutoshi Kobayashi1 (1. Kyoto Institute of Technology, 2. Okayama Prefectural University)
Keywords:
Soft Errors,Flip-Flop