General Conference of the Institute of Electronics, Information and Communication Engineers

Presentation Information

11:45 AM - 12:00 PM JST(2:45 AM - 3:00 AM UTC)

[C-3_C-4-08]Ⅲ-Ⅴ/Si hybrid semiconductor optical amplifiers using chip-on-wafer bonding process

〇Hidenari Fujikata^1,2, Takehiko Kikuchi^1,2,3, Naoko Inoue^1,2,3, Naoki Fujiwara^1,2,3, Kento Komatsu^1,2,3, Takuo Hiratani^1,2,3, Takuya Mitarai^1,2,3, Yuuji Koyama^1,2, Takuya Okimoto^1,2, Yuhki Itoh^1,2, Ryuya Sasaki³, Tsukuru Katsuyama³, Nobuhiko Nishiyama^1,3, Hideki Yagi^1,2,3 (1. Photonics Electronics Technology Research Association, 2. Sumitomo Electric Industries, 3. Institute of Science Tokyo)

Keywords:

Heterogeneous integration,Silicon photonics,Semiconductor optical amplifier

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