Presentation Information
[2(Invited)]A Green LED Microdisplay with 1.1-µm-Diameter Mesa Structures Using Pixel-Level Cu-Cu Connections(20min.)
*Akihiro Kurisu1, Takanobu Akagi1, Haruki Tsuchiya1, Toshihiro Miura1, Ryosuke Matsumoto1, Mikio Takiguchi1, Toshihiko Watanabe1, Akira Ohmae1, Koichi Amari1, Toru Sasaki1, Michihiro Kanno1, Koichi Nagasawa1 (1. Sony Semiconductor Solutions Corporation (Japan))
Keywords:
microLED,microdisplay,active matrix,Cu-Cu hybrid bonding,augmented reality
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