Presentation Information
[1(Invited)]Photodefinable Hardmask Materials for Ultrafine Pitch Advanced Packaging and Display Applications(20min.)
*Rui Peng1、Danielle Chamberlin1、Alexis Miranda1、Nisa Zaheer1、Marissa Tranquilli1、Forrest Etheridge1、Yu Kambe1、Thomas McCune1、Ralu Divan2、David Czaplewski2、Dmitri Talapin1,3,2、Siyang Liu4、Hongbin Yu4 (1. NanoPattern Technologies, Inc. (USA), 2. Argonne National Laboratory (USA), 3. University of Chicago (USA), 4. Arizona State University (USA))
Keywords:
Advanced Packaging,2.5D Packaging,Hardmask,Plasma Etch
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