Presentation Information
[1(Invited)]Photodefinable Hardmask Materials for Ultrafine Pitch Advanced Packaging and Display Applications(20min.)
*Danielle Chamberlin1, Rui Peng1, Thomas McCune1, Alexis Miranda1, Forrest Etheridge1, Yu Kambe1, Ralu Divan2, David Czaplewski2, Yi Chun Liu3, Dmitri Talapin1,3, Siyang Liu4, Hongbin Yu4 (1. NanoPattern Technologies, Inc. (USA), 2. Argonne National Laboratory (USA), 3. University of Chicago (USA), 4. Arizona State University (USA))
Keywords:
Advanced Packaging,2.5D Packaging,Hardmask,Plasma Etch
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