International Symposium on Sputtering & Plasma Processes (ISSP)

*Lin Kuan Chen¹, Lou Bih Show^2,3, Li Chia Lin⁴, Lee Jyh Wei^1,4,5,6(1. Department of Materials Engineering, Ming Chi University of Technology, New Taipei City, Taiwan, 2. Chemistry Division, Center for General Education, Chang Gung University, Taoyuan, Taiwan, 3. Department of Orthopaedic Surgery, New Taipei Municipal TuCheng Hospital, Chang Gung Memorial Hospital, Taiwan, 4. Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, New Taipei, Taiwan, 5. College of Engineering, Chang Gung University, Taoyuan, Taiwan, 6. High Entropy Materials Center, National Tsing Hua University, Hsinchu, Taiwan)