[AP1-01](Keynote) Evolution of interconnect metallurgy and future roadmap
*Takeshi Nogami1(1. IBM Research)
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*Takeshi Nogami1(1. IBM Research)
*Hiroki Otsuyama1, Kotaro Yataka1, Takafumi Yunoue1, Naoto Yamashita1, Takamasa Okumura1, Kunihiro Kamataki1, Kazunori Koga1, Masaharu Shiratani1, Naho Itagaki1(1. Graduate School of Information Science and Electrical Engineering, Kyushu University)
*Osamu Nakagawara1(1. I-PEX Piezo Solutions Inc.)
*Hyeong-U Kim1,2(1. Department of Plasma Engineering, Korea Institute of Machinery & Materials (KIMM), 2. Department of Nano-mechanics, University of Science and Technology (UST))
*Peter Klein1, Jaroslav Hnilica1, Martin Ondryáš1, Vjačeslav Sochora2, Martin Učík1,3, Ján Klusoň3, Petr Vašina1(1. Masaryk University, Brno, Czech republic, 2. SHM s. r. o., Šumperk, Czech Republic , 3. PLATIT a.s., Šumperk, Czech Republic )
*Daniel Lundin1, Ulf Helmersson1, Martin Cada2, Zdenek Hubicka2(1. Linköping University, 2. Academy of Science of the Czech Republic)
*Thomas Schütte1, Peter Neiß1, Marius Radloff1, Hokuto Kikuchi1(1. PLASUS GmbH)
*Thomas Gilmore1(1. Impedans Ltd.)
*Jinn P. Chu1(1. National Taiwan University of Science and Technology)
*Takeshi Yanagida1,2(1. The University of Tokyo, 2. Kyushu University)
*Kunio Okimura1, Takuto Ohnuki1, Yiqi Liu1, Shoya Inagaki2, Yuji Muraoka3, Joe Sakai4, Aiko Narazaki5, Masashi Kuwahara5(1. Tokai University, 2. Faculty of Science, Okayama University, 3. RIIS, Okayama University, 4. Toshima Manufacturing Co. Ltd, 5. National Institute of Advanced Industrial Science and Technology)
*Jan Kejzlar1,2, Martin Hruška1, Přemysl Fitl1, Michal Novotný2, Joris More-Chevalier2, Takayuki Kiba3, Midori Kawamura3, Ján Lančok2, Martin Vrňata1(1. University of Chemistry and Technology, Prague, 2. Institute of Physics of the Czech Academy of Sciences, 3. Kitami Institute of Technology)
*Jyh-Wei Lee1(1. Ming Chi University of Technology)
Stanislava Debnarova1, Tomasz Stasiak1, Lukas Vrana1, Vilma Bursikova1, Matej Fekete1, Zsolt Czigany2, Katalin Balazsi2, Shuyao Lin3, Nikola Koutna3, Petr Vasina1, *Pavel Soucek1(1. Masaryk University, 2. HUN REN Centre for Energy Research, 3. Technische Universität Wien)
*shang hua Tseng1, Jyh-Wei Lee2,5,6,7, Bih-Show Lou3,4, Chaur-Jeng Wang1(1. National Taiwan University of Science and Technology, Taipei, Taiwan, 2. Department of Materials Engineering, Ming Chi University of Technology, New Taipei, Taiwan., 3. Chemistry Division, Center for General Education, Chang Gung University, Taoyuan, Taiwan, 4. Department of Orthopaedic Surgery, New Taipei Municipal TuCheng Hospital, Chang Gung Memorial Hospital, Taiwan, 5. Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, New Taipei, Taiwan, 6. College of Engineering, Chang Gung University, Taoyuan, Taiwan, 7. High Entropy Materials Center, National Tsing Hua University, Hsinchu, Taiwan)
*Tomas Fiantok1, Marek Vidiš1, Marek Gocník1,2, Peter Jr. Švec3, Štefan Nagy3, Martin Truchlý1, Vitalii Izai1, Tomáš Roch1, Leonid Satrapinskyy1, Viktor Šroba1, Michael Meindlhumer2, Branislav Grančič1, Peter Kúš1, Jozef Keckes2, Marián Mikula1,3(1. Comenius University Bratislava, Slovakia, 2. Montanuniversität Leoben, Austria, 3. Slovak Academy of Sciences, Bratislava, Slovakia)
*Christian Scholz1, Julien Keraudy2, Florian Rovere2(1. Oerlikon Japan Co., Ltd., Hiratsuka, Japan, 2. Oerlikon Surface Solutions AG, Balzers, Liechtenstein.)
Yen-Chen Liu1, Yin-Hung Chen1,2, Shikha Akshay Joshi3, Chao-Kuang Wen1, Tung-Han Chuang2, *Sheng-Chi Chen1,4, Chih-Ping Chen1(1. Department of Materials Engineering and Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, Taipei 243, Taiwan, 2. Department of Materials Science and Engineering, National Taiwan University, Taipei 106, Taiwan, 3. Department of Materials Engineering, Indian Institute of Science, Bangalore-560012, India., 4. College of Engineering and Center for Green Technology, Chang Gung University, Taoyuan 333, Taiwan)
*Cheng-Hsun-Tony Chang1, Yu-Ting Chow2, Pei-Cheng Jiang3, Jyh-Shen Tsay4(1. Department of Electronic Engineering, Minghsin University of Science and Technology, Hsinchu 30401, Taiwan., 2. Department of Electro-Optical Engineering, Minghsin University of Science and Technology, Hsinchu 30401, Taiwan., 3. Department of Mechanical Engineering, Minghsin University of Science and Technology, Hsinchu 30401, Taiwan., 4. Department of Physics, National Taiwan Normal University, Taipei, Taiwan.)
*Pei-Chen Huang1,2,3, Ting-Jia Yang2, Man-Ying Wang1,2,3, Jing-Jong Shyue1,3, Wei-Chun Lin2(1. Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan., 2. Department of Photonics, National Sun Yat-sen University, Kaohsiung, Taiwan., 3. Research Center for Applied Sciences, Academia Sinica, Taipei, Taiwan.)
*Chih-Yi Liu1, Chia-Yu Yang1, Hu-Guan Chiu1, Dong-Han Du1, Zhi-Lin Lee1(1. National Kaohsiung University of Science and Technology)
*Chin-Chia Kuo1, Yi-Ting Lin2, Wei-Cheng Lien2, Chih-Pien Chen1, Yi-Ting Lai1,3,4(1. Department of Materials Engineering, Ming Chi University of Technology, 2. Hyson Technology Inc, 3. Biochemical Technology R&D Center, Ming Chi University of Technology, 4. Center for Plasma and Thin Film Technologies, Ming Chi University of Technology)
*Qixin GUO1, Koutarou Nonaka1, Katsuhiko Saito1, Tooru Tanaka1(1. Saga University)
*Akimitsu Hatta1, Sukma Wahyu Fitriani2, Ryota Oshio1(1. Kochi University of Technology, 2. Kyushu University)
*Yuejie TAN1, Shinsuke Miyajima1(1. Tokyo Institute of Technology)
*Lin Kuan Chen1, Lou Bih Show2,3, Li Chia Lin4, Lee Jyh Wei1,4,5,6(1. Department of Materials Engineering, Ming Chi University of Technology, New Taipei City, Taiwan, 2. Chemistry Division, Center for General Education, Chang Gung University, Taoyuan, Taiwan, 3. Department of Orthopaedic Surgery, New Taipei Municipal TuCheng Hospital, Chang Gung Memorial Hospital, Taiwan, 4. Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, New Taipei, Taiwan, 5. College of Engineering, Chang Gung University, Taoyuan, Taiwan, 6. High Entropy Materials Center, National Tsing Hua University, Hsinchu, Taiwan)
*Jaewon Lim1(1. Jeonbuk National University)
*Shun Fujihara1, Hiroshi Toyota1(1. Hiroshima Institute of Technology)
*Junichi Yanagisawa1, Ruiji Shigesada1, Masayoshi Ichimiya1, Takahiko Ban1, Atsushi Kinomura2(1. The University of Shiga Prefecture, 2. Kyoto University)
*Junpei Kidokoro1, Peng Yu1, Kunio Okimura1, Md. Suruzu Mian2, Toshihiro Nakanishi3(1. Graduate School of Engineering, Tokai University, 2. Faculty of Science and Technology, Seikei University, 3. Department of Electronic Science and Engineering, Kyoto University)
*Peng Yu1, Junpei Kidokoro1, Kunio Okimura1, Md. Suruz Mian2, Yosuke Nakata3(1. Graduate School of Engineering, Tokai University, 2. Faculty of Science and Technology, Seikei University, 3. Graduate School of Engineering Science, Osaka University)
*Anjali 1, Weon Cheol Lim2, Aditya Sharma3, Moditma1, Sangsul LEE4,5, H J Shin6, Keun Hwa Chae2, Jitendra Pal Singh1(1. Department of Sciences (Physics), Manav Rachna University、2. Advanced Analysis and Data Center, Korea Institute of Science and Technology、3. Department of Physics, University of Petroleum and Energy Studies、4. Pohang Accelerator Laboratory、5. Department of Semiconductor Engineering、6. Department of Physics, Chungbuk National University)
*Chia-Lin Li1, Sen-You Hou2, Jyh-Wei Lee1,3,4,5, Po-Yu Chen2(1. Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, 2. Department of Materials Science and Engineering, National Tsing Hua University, 3. Department of Materials Engineering, Ming Chi University of Technology, 4. College of Engineering, Chang Gung University, 5. High Entropy Materials Center, National Tsing Hua University)
*Yosuke Abe1, Takahito Nishimura1, Akira Yamada1(1. Tokyo Institute of Technology)
*Wei-Jie Wang1, Jinn P Chu1(1. National Taiwan University of Science and Technology)
*Ryo Taguchi1, Kazuki Tajima1, Hiroshi Watanabe1, Takashi Kubota1, Haruhisa Akiyama1(1. National Institute of Advanced Science and Technology)
*Taisei Motomura1, Kenshin Takemura1, Toshimi Nagase1, Nobutomo Morita1, Wataru Iwasaki1, Naoki Matsuda1, Tatsuo Tabaru1(1. AIST)
Itsuki Misono1, *Taisei Motomura2, Masato Uehara2, Tatsuo Tabaru2, Tetsuya Okuyama1,3(1. NIT, Kurume College, 2. AIST, 3. Kyushu Univ.)
*Pei-Cheng Jiang1, Yu-Ting Chow2, Cheng-Hsun-Tony Chang3(1. Department of Mechanical Engineering, Minghsin University of Science and Technology, Hsinchu, Taiwan., 2. Department of Semiconductor and Electro-Optical Technology, Minghsin University of Science and Technology, Hsinchu, Taiwan., 3. Department of Electronic Engineering, Minghsin University of Science and Technology, Hsinchu, Taiwan.)
*Ryota Narishige1, Naoto Yamashita1, Kunihiro Kamataki1, Takamasa Okumura1, Kazunori Koga1, Masaharu Shiratani1, Naho Itagaki1(1. Kyushu University)
*Takafumi Yunoue1, Takamasa Usami2, Michihiro Yamada2, Kotaro Yataka1, Hiroki Otsuyama1, Naoto Yamashita1, Kohei Hamaya2, Naho Itagaki1(1. Kyushu University, 2. Osaka University)
*Mirano Oneda1, Jumpei Kito1, Seiya Watanabe1, Genki Sano1, Takahiro Bando1, Hirofumi Takikawa1, Hiroaki Sugita2, Takahiro Hattori2, Hiroki Gima2(1. Toyohashi University of Technology, 2. OSG Co., Ltd., Research & Development Center)
*Kira Magali Franco Davalos1, Alejandro Jesus Gorostiaga Tippach1, Bruno Nicolás Sánchez Acosta 1, Clara Celia Thielmann1, Feng-Li Tea2, Yu-Lin Kuo2(1. Taiwan-Paraguay Polytechnic University , 2. Department of Mechanical Engineering National Taiwan University of Science and Technology )
*Kosei Kikuchi1, Keiichi Takizawa1, Kanta Mori1, Robert Boyd2, Sebastian Ekeroth2, Ulf Helmersson2, Nikolay Britun3, Tetsuhide Shimizu1(1. Tokyo Metropolitan University, 2. Linköping University, 3. Nagoya University)
*Yamato Yokoyama1, Midori Kawamura1, Kazuhisa Suzuki1, Takayuki Kiba1(1. Kitami institute of technology)
*Pei-Chen Huang1,2,3, Ting-Jia Yang2, Man-Ying Wang1,2,3, Jing-Jong Shyue1,3, Wei-Chun Lin2(1. Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan., 2. Department of Photonics, National Sun Yat-sen University, Kaohsiung, Taiwan., 3. Research Center for Applied Sciences, Academia Sinica, Taipei, Taiwan.)
*Jian-Rong Chen1, Peng Kun Cheng1(1. Ming Chi University of Technology)
*Akihiro Shimizu1,2, Kazuhiro Fukada3, Shinichi Endo1, Shoko Kobayashi4, Koichi Higashimine4(1. Ushio Inc., 2. Gifu University, 3. Shibaura Machine Co., Ltd., 4. Japan Advanced Institute of Science and Technology)
*Beng Kang TAY1(1. Centre for Micro- and Nano-Electronics (CMNE), School of Electrical and Electronic Engineering, Nanyang Technological University)
Yu Jie Chen1, Chia Feng Hsieh2, *Shu-Chuan Liao1,2(1. Tamkang University, 2. DaYeh University)