International Symposium on Sputtering & Plasma Processes (ISSP)

*Chia-Lin Li¹, Sen-You Hou², Jyh-Wei Lee^1,3,4,5, Po-Yu Chen²(1. Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, 2. Department of Materials Science and Engineering, National Tsing Hua University, 3. Department of Materials Engineering, Ming Chi University of Technology, 4. College of Engineering, Chang Gung University, 5. High Entropy Materials Center, National Tsing Hua University)