International Symposium on Sputtering & Plasma Processes (ISSP2024)
Jul 2 - Jul 5, 2024
International Symposium on Sputtering & Plasma Processes (ISSP2024)
Jul 2 - Jul 5, 2024
[P3-32]Analysis of adhesion structure between copper seed layer formed via medium-vacuum sputtering and cycloolefin polymer film
*Akihiro Shimizu1,2, Kazuhiro Fukada3, Shinichi Endo1, Shoko Kobayashi4, Koichi Higashimine4(1. Ushio Inc., 2. Gifu University, 3. Shibaura Machine Co., Ltd., 4. Japan Advanced Institute of Science and Technology)