International Symposium on Sputtering & Plasma Processes (ISSP)

*shang hua Tseng¹, Jyh-Wei Lee^2,5,6,7, Bih-Show Lou^3,4, Chaur-Jeng Wang¹(1. National Taiwan University of Science and Technology, Taipei, Taiwan, 2. Department of Materials Engineering, Ming Chi University of Technology, New Taipei, Taiwan., 3. Chemistry Division, Center for General Education, Chang Gung University, Taoyuan, Taiwan, 4. Department of Orthopaedic Surgery, New Taipei Municipal TuCheng Hospital, Chang Gung Memorial Hospital, Taiwan, 5. Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, New Taipei, Taiwan, 6. College of Engineering, Chang Gung University, Taoyuan, Taiwan, 7. High Entropy Materials Center, National Tsing Hua University, Hsinchu, Taiwan)