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Technical sessionOW3: Deep and machine learning methodology in the context of application to computational engineering

[OW3]Technical session 3

Fri. Sep 20, 2024 9:00 AM - 11:20 AM JST
Fri. Sep 20, 2024 12:00 AM - 2:20 AM UTC
Room 21AB(Kitakyushu International Conference Center 2F)
Chair:Masanobu Horie(RICOS Co. Ltd.), Takuya Toyoshi(Aichi University of Technology)
9:00 AM - 9:40 AM JST(12:00 AM - 12:40 AM UTC)

[OW3-07]Interpolating Neural Network: A Seamless Integration of Numerical Analysis, Tensor Decomposition, and Artificial Intelligence

*Chanwook Park1, Wing K. Liu1 (1. Northwestern University (United States of America))
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9:40 AM - 10:10 AM JST(12:40 AM - 1:10 AM UTC)

[OW3-08]Equation discovery for regularization in multiple crack propagation

*Rekisei Ozawa1,2, Yoshitaka Wada2 (1. Nihon Emsco Co. Ltd. (Japan), 2. Kindai University (Japan))
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10:10 AM - 10:50 AM JST(1:10 AM - 1:50 AM UTC)

[OW3-09]Evaluating and Engineering Material Properties for Desired Outcomes Using Multimodal Machine Learning

*Ankit Shrivastava1, Matias Kalaswad1, Marta D'Elia1, David P Adams1, Habib N Najm1 (1. Sandia National Laboratories (United States of America))
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10:50 AM - 11:20 AM JST(1:50 AM - 2:20 AM UTC)

[OW3-10]Enhanced Communication and Effectiveness of
a System Using AI to Convert Static Pictograms into Motion pictograms

*Natsumi Okatani1, Shioya Ryuji1, Yasushi Nakabayashi1 (1. Toyo University (Japan))
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