Presentation Information

[64]Kinetics of the reactive diffusion between solid Cu and liquid Sn-Bi alloys

*Minho O1, Haruka Fujita1, Equo Kobayashi1, Masanori Kajihara1 (1. Dept. Mater. Sci. Eng., Tokyo Institute of Technology)

Keywords:

拡散,固相-液相界面,金属間化合物,粒界拡散,界面反応

The growth behavior of intermetallic compounds at the solid-liquid interface was experimentally observed to examine the reactive diffusion between solid Cu and liquid Sn-Bi alloys.