[G] Melting and solidification process/High temperature process

4:25 PM - 4:40 PM JST(7:25 AM - 7:40 AM UTC)

[219] Influence of Cooling Conditions on Microstructure of Melted Mark on Copper Wire

*Suphattra Sachana¹, Kohei Morishita¹, Hirofumi Miyahara¹ (1. Kyushu University)

Keywords:

Copper wire,Copper oxide,Microstructure

A change in the structure of melted marks on the copper wire under cooling conditions is useful to describe fire behaviors in order to identify the origin of the fire accident.