Session Details
[S5]S5.Materials Science of Additive Manufacturing(2)
Thu. Sep 22, 2022 9:00 AM - 12:10 PM JST
Thu. Sep 22, 2022 12:00 AM - 3:10 AM UTC
Thu. Sep 22, 2022 12:00 AM - 3:10 AM UTC
Rm. N C31,3Flr. Build.C
Chair:Kohei Morishita(Kyushu University)
※表示の講演時間には質疑応答時間も含みます。
(質疑応答時間5分、基調講演と招待講演は5~10分)
(質疑応答時間5分、基調講演と招待講演は5~10分)
[S5.10]In-situ Observation of Rapid Melting and Rapid Solidification Phenomena by Using Synchrotron X-ray Imaging
*Kohei MORISHITA1, Kentaro UESUESUGI2, Hideyuki YASUDA3, Hirofumi MIYAHARA1 (1. Kyushu University, 2. JASRI, 3. Kyoto University)
[S5.11]Rapid melting in powder-bed fusion of hypoeutectic Al-Si alloy analyzed by computational thermal-fluid dynamics
*Yuya FURUSHIRO3, Masayuki OKUGAWA1,2, Yuichiro KOIZUMI1,2, Takayoshi NAKANO1,2 (1. Osaka Univ., 2. Osaka Univ. AM center, 3. Osaka Univ.)
[S5.12]Evaluation Method for Solidification Cracking Susceptibility during Additive Manufacturing Process
*Kouta KADOI1, Yukiya MATSUMOTO2, Hiroyuki CHIBA3 (1. JWRI, Osaka Univ., 2. Osaka Univ. (Present: SHIMANO), 3. Tokyo Metropolitan Industrial Technology Research Institute)
[S5.13]Effect of Si content on microstructure of laser powder bed fused Al-Si alloy
*Yusuke SASA1, Mai KUNIEDA1, Asuka SUZUKI2, Naoki TAKATA2, Makoto KOBASHI2, Masaki KATO3 (1. 名古屋大工(院生)、2. 名古屋大工、3. あいち産業科学技術総合センター)
break
[S5.14]Electron microscopy studies on the SUS316L steel produced by LPBF
*Kazuhisa SATO1, Shunya TAKAGI1, Satoshi ICHIKAWA1, Takuya ISHIMOTO2,3,4, Takayoshi NAKANO3,4 (1. Research Center for UHVEM, Osaka Univ., 2. Aluminium Research Center, Univ. Toyama, 3. Faculty of Eng., Osaka Univ., 4. AM Center, Osaka Univ.)
[S5.15]Influence of Heat treatment on Microstructure and Mechanical Properties of Additively Manufactured Maraging Steel
*Tetsuhiko ONDA1, Yuya Nakano2, Sho Shimomura3, Akira Otsu2, Takahisa Shobu4, Zhong-Chun Chen1 (1. Tottori Univ., 2. Tottori Univ.(Graduated student), 3. Tottori Univ.(G.S. Present: Murata Manufacturing Co., Ltd.), 4. Japan Atomic Energy Agency)
[S5.16]Synthesis of TiNi-layer by electron beam scanning on Ni plated CP-Ti-substrate
*Lei WANG1, Masayuki OKUGAWA1,2, Yuichiro KOIZUMI1,2, Hirohazu KONISHI1, Takayoshi NAKANO1,2 (1. Osaka Univ. Eng., 2. Osaka Univ. AM center)
